Our production capacity

PCB Item           Manufacture Capacity

Layer Counts        1--20L

Base Material        FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)

Material Thickness(mm)        0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2   

Max board size(mm)        1200x400mm

Board Outline Tolerance        ±0.15mm   

Board Thickness        0.4mm--3.2mm   

Thickness Tolerance        ±8%   

Minimum line/space        0.1mm  

Min Annular Ring        0.1mm   

SMD Pitch        0.3mm

Holes

Min  Hole Size(mechanical)       0.2mm

Min Hole Size(laser hole)        0.1mm   

Hole Size Tol (+/-)         PTH:±0.075mm;NPTH: ±0.05mm   

Hole Position Tol        ±0.075mm

Plating

HASL/LF HAL        2.5um   

Immersion Gold        Nickel  3-7um  Au:1-5u''   

Surface Finish        HAL,ENIG,Plated Gold,Immersion Gold,OSP   

Copper Weight        0.5--6oz

Color 

Solder mask        Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue   

Silk screen         White, Black, Blue,Yellow   

Acceptable File Format        Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000  Certificate         ROSH,ISO9001,UL

FPC

FPC       ItemManufacture Capacity

Layer Counts        1--10L   

Min. Line Width        0.05mm   

Min. Hole Size        0.15mm PTH   

Min. PTH Hole Ring        0.45mm   

Min. Gap between Cover Layer and Pad        0.1mm   

Min. Gap between Trace and Outline        0.2mm   

Trace Width Tolerance        +/-0.05mm L≤ 25mm   

Hole Size Tolerance        +/-0.05mm   

Stiffener and Outline Tolerance        +/-0.25mm   

Surface Treatment        ENIG, Gold Plating, HAL, Plating Pb-Sn

We are professional manufacture, so we can offer below service:

PCB design

Reverse Engineering-PCB copy, PCB clone, IC decode

Quick prototyping

Components sourcing and purchasing

FPC making Mold making

and plastic injection

PCB, PCBA SMD, SMT assembly

Supply chain service

Testing

AOI Testing

Check for line width and spacing

Check for solder paste

Check for components down to 0201"

Check for missing components, off set, incorrect parts, polarity

X-RAY Testing

Check for the BGAS

Check for the Micro BGAS

Check for the chip scale packages

Check for the Bare board

IN-Circuit Testing

Power-up Test

Function Test

Flash device programming

Packing

1.Firstly seal products with hermetic plastic bag vrey well

2.Then using bubble or foam sheet to seperate them

3.Finally paper carton packing

Shipping

1.After deposit received,it would need 3 days for sample and 5-7 days for quantity production It would depend on your drawing and process plan.

2.DHL,FEDEX,UPS delivery ,Barely deliever it by vessel.

FAQ

1.  Q: How to contact us?

     A:You can contact online or send us email for any question

2. Q: How to start for inquiry?

    A: Please send us full manufacture requirements and documents for quotation.Bill of material(BOM), FPC Gerber file, test document or test procedure, demand quantity, product sample or photos will be highly appreciate. 

3.  Q:What is the payment?

     A: For new customer, it is 100% prepayment, for old customer, we accept some prepayment and some before shipping.

4.  Q:What does MONDO need for other services?   

     A:We offer one-stop service of FPC/PCB/Rigid FPC manufacture, including FPC design, FPC manufacture, component sourcing, assembly .

5.  Q: When can I get samples?

     A: 1-3 working days after all documents are confirmed

6.  Q: Do you provide sample?

     A: Yes, we provide free sample.

7.  Q: Do you provide ODM and OEM?

     A: Yes, ODM and OEM are welcomed.

8.  Q: What are the payment term?

     A: T/T,L/C,Western Union,Paypal.

9.  Q: Do you have an order minimum?

     A: We accept order with as low as a quantity of 1 pcs.

10.  Q: Are you the factory

       A:Yes, we are factory in Bao'an District, Shenzhen City, China.